M06000 - SEMI M60 - シリコンウェーハ評価のためのSiO2の経時絶縁破壊特性の試験方法 Revision:SEMI M60-0306E2 - Superseded chemical mechanical planarization (CMP)

chemical mechanical planarization (CMP)

certification

Only the bottom half of the kinematic coupling is specified so that suppliers can be flexible in designing wafer carriers that can mate with it

This Document covers requirements for hydrogen chloride used in the semiconductor industry

M06000 - SEMI M60 - シリコンウェーハ評価のためのSiO2の経時絶縁破壊特性の試験方法 Revision:SEMI M60-0306E2 - Superseded chemical mechanical planarization (CMP)global Silicon Wafer Committee20051129global Audits and Reviews Subcommittee20062www. semi. org20063CD ROM2005120053 E2006510. 2. 7 GOIGate Oxide Integrity3M51TZDB(B)(C)TZDB Referenced SEMI Standards SEMI C3. 6 Standard for Phosphine (PH3) in Cylinders, 99. 98% Quality SEMI C3. 54 Gas Purity Guideline for Silane (SiH4) SEMI C21 Specifications and Guideline for Ammonium Hydroxide SEMI C27 Specifications and Guidelines for Hydrochloric Acid SEMI C28