Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD SiC-4H film on SiC-4H Attention Considering the best interest

Attention Considering the best interest of the service life of the blade

Although PEO does not have a good ionic conductivity (around 10^-4 - 10^-8)

Color:                             colorless

Chemical Composition Ni (mol%) 90

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD SiC-4H film on SiC-4H Attention Considering the best interestEQ ECO 419 LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2. 0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck. SPECIFICATIONS: Width 6. 5" Thickness 0. 25mm Length Price sold by 10 feet per quantity Item It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing. Application Notes