P02800 - SEMI P28 - 集積回路製造用オーバーレイ計測テストパターン StdPbc-0516 1-1296 (technical revision)

1-1296 (technical revision)

SEMI E39 —Object Services Standard: Concept

These voids impede the flow of heat from the chip to the substrate (package)

flip chip bumping

P02800 - SEMI P28 - 集積回路製造用オーバーレイ計測テストパターン StdPbc-0516 1-1296 (technical revision)NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI global Micropatterning Committee2007425global Audits and Reviews Subcommittee20076www. semi. org1996 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met.