Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile Ingestion-build-143074 Size codes and associated body

Size codes and associated body measurements

extensive notes and references help guide the interested reader towards the primary and secondary sources used in the preparation of this PD

It applies to paper and board

air-melted and softened steel products

Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile Ingestion-build-143074 Size codes and associated body1 Scope This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e. g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production