G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default TitleThis document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i. e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI Standards SEMI G14 Plastic Molded DIP Tooling SEMI G16 Plastic Chip Carrier Tooling SEMI G36 Plastic Molded High Density TAB Quad Tooling SEMI G37 Plastic Molded SO Package Tooling

and incoming or outgoing inspection

and behavior identified in this Document

注意：SEMI E142

이전 개정판은 2003년 11월에 발행되었다

本ガイド文書は，一連の装置データ取得（EDA）SEMIスタンダードに関して追加の情報を提供し，これら規格間の関係を説明し，EDA仕様の適切な適用を確実にするために実装の基本コンセプトを提示する。

9% hydrofluoric acid used in the semiconductor industry

This Test Method defines a particle shedding evaluation method for 25 cm filter cartridges of various media (e

SEMI M54-0319 (technical revision)

This guide is intended for use in abatement selection for both gaseous and particulate contaminant materials potentially emitted from semiconductor manufacturing facilities

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 20

本安全ガイドラインは，Environmental Health & Safety Global Technical Committeeで技術的に承認されている。現版は2015年1月5日，global Audits and Reviews Subcommitteeにて承認された。2015年5月にwww

No information is provided concerning the diameter of the wafer at points other than those measured