E17800 - SEMI E178 - Guide for EDA Freeze Version Revision:SEMI E178-0120 - Superseded 設備的本質危險

設備的本質危險

SEMI 3D17 — Specification for Reference Material for Bonded Wafer Stack Void Metrology

This Test Method is specifically directed to the notch dimensions specified in SEMI M1

Materials kinds or cleanliness are not defined

E17800 - SEMI E178 - Guide for EDA Freeze Version Revision:SEMI E178-0120 - Superseded 設備的本質危險* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1