Silicon PELCO® FIB Lift-Out Grid TEM Grids

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Description

Silicon PELCO® FIB Lift-Out Grid TEM GridsDESCRIPTION The thickness of the silicon lift out grids is 100m which makes them compatible with all standard TEM holders. Perfect half circular shape which fits nicely in the TEM grid holder. Debris free, metal free lift out grids which readily bond with Pt to attach the lamellas. Straight edges, similar to the Cu and Mo grids; easy to handle. B doped, conductive silicon minimizes charging during sample preparation and TEM imaging. Available with

Bump height (about 90nm) and width (about 75nm) are not calibrated

making it ideal for imaging a wide variety of hard and soft materials

5º Side Angle: 22

xSol 25 High Load Berkovich

The legacy DDESP-10 is no longer available for ordering

REQUIRES a minimum of one-day installation/training (Model ITCSA)which must be purchased separately when purchased with any other on-siteinstallation/training package (Models ITCS or ITCS3)

differential contrast and confocal

STM tip holder fits directly onto Dimension/BioScope SPM heads to enable Scanning Tunneling Microscopy (STM) operation

US Patent #7619225

Electric field cantilever holder DESCRIPTION

Pre-mounted on half washer mounts for easy exchange in the AFM head

standard Dimension or EnviroScope Fluid Cell (Model ESEC-CELL)

Exchange/Return Notes